- Establishes an electrically well-conductive solder connection between the components and the solder pads
- The solder paste is applied to the soldering surfaces of the circuit boards. The components to be soldered are then pressed into the paste on the PCB.
- The subsequent soldering process causes the solder paste particles to fuse with the PCBs and component contacts.
- The melting process is facilitated by the surface tension-reducing flux.
Length: 60 mm Width: 60 mm Height: 25 mm
